Our flagship chipset integrates high-mobility bismuth transistors for logic operations, spintronic accelerators for non-volatile processing, and hollow-core vacuum waveguides for minimal-loss interconnects. Fabricated on standard 300mm wafers at sub-2nm nodes, this platform achieves:

• Electron mobility exceeding 300 cm²/V·s
• Single-qubit fidelity of 99.995% and two-qubit fidelity >99.5%
• Propagation losses below 0.3 dB/cm in vacuum cores
• Power efficiency improvements of up to 60%, with operational power draws as low as 20W per module
• Source purity and entanglement metrics approaching 99.9% in hybrid configurations

These estimates reflect lab prototype measurements, with full-scale systems projected to enable modular quantum workloads and exascale classical compute. The long-term mission is to scale toward billion-qubit quantum architectures by 2031.

Wafer → Chip → Package → Edge → Box → Compute System

1. Wafer Advanced materials are deposited and patterned on 300mm wafers using epitaxial and etching techniques, yielding over 2 million tested devices per run at sub-2nm lithography nodes.

2. Chip Hybrid architectures implement logic, memory, and quantum elements, with entanglement and error correction supported through integrated spintronic and bismuth pathways, enabling modular quantum scaling via loss-absorbing designs adapted from our materials R&D.

3. Package Chips are assembled with automotive-grade controls using standard bonding and heat-sinking methods for modular scalability, incorporating "jelly"-like adaptive layers for shock and thermal absorption.

4. Edge Rack-based units house multiple packages, networked via high-bandwidth electrical and vacuum-enhanced links, with Formula 1-inspired cooling for high-density operations.

5. Box Our vacuum-sealed boxes provide a hermetic environment, separating the internal system from external contaminants like dust and humidity to ensure pristine performance. Each box offers enhanced thermal management with cooling power up to 50W, accommodating hundreds of chips while achieving 70% energy efficiency gains over traditional setups.

6. Compute System Facility-scale deployments will deliver exascale classical compute and hybrid quantum capabilities, with bespoke solutions for institutional partners starting in 2027, including targeted applications such as aerospace simulation, automotive optimization, or materials discovery.

Screner Innovations remains committed to 2027 commercial launch while pursuing long-term modular quantum scaling toward billion-qubit systems by 2031.